Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Radiation sensitive composition or product or process of making
Patent
1988-07-11
1991-01-15
Michl, Paul R.
Radiation imagery chemistry: process, composition, or product th
Imaging affecting physical property of radiation sensitive...
Radiation sensitive composition or product or process of making
430281, 430285, 430287, 430288, 430302, 430545, 430910, G03C 168, G03C 172
Patent
active
049853392
ABSTRACT:
A light-sensitive material comprises a light-sensitive layer containing a light-sensitive silver halide, a reducing agent and a polymerizable compound having an ethylenic unsaturated group which is provided on a support. The light-sensitive layer contains a polymer binder having an ethylenic unsaturated double bonding group in its side chain. The light-sensitive material is advantageously employable as a lithographic plate.
REFERENCES:
patent: 4293635 (1981-10-01), Flint et al.
patent: 4350759 (1982-09-01), Fitzgerald et al.
patent: 4353978 (1982-10-01), Leberzammer et al.
patent: 4448850 (1984-05-01), Upsun et al.
patent: 4537855 (1985-08-01), Ide
patent: 4557997 (1985-12-01), Iwasaki et al.
patent: 4629676 (1986-12-01), Hayakawa et al.
patent: 4687727 (1987-08-01), Toyama et al.
patent: 4722885 (1988-02-01), Yokoyama et al.
patent: 4764451 (1988-08-01), Ishikawa
patent: 4806449 (1989-02-01), Hofmann et al.
patent: 4806450 (1989-02-01), Hofmann et al.
Hayakawa Yoshihide
Koizumi Shigeo
Doody Patrick
Fuji Photo Film Co. , Ltd.
Michl Paul R.
LandOfFree
Light-sensitive material containing silver halide, reducing agen does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Light-sensitive material containing silver halide, reducing agen, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Light-sensitive material containing silver halide, reducing agen will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-54857