Light generating semiconductor device and method of making...

Semiconductor device manufacturing: process – Making device or circuit emissive of nonelectrical signal – Compound semiconductor

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C438S047000, C438S455000, C438S459000, C438S977000, C257SE21125

Reexamination Certificate

active

10911653

ABSTRACT:
In a method of making a semiconductor light generating device, a GaN-based semiconductor portion is formed on a GaN or AlGaN substrate. The GaN-based semiconductor portion includes a light generating film. An electrode film is formed on the GaN-based semiconductor film. A conductive substrate is bonded to a surface of the electrode film using a conductive adhesive. After bonding the conductive substrate, the GaN or AlGaN substrate is separated from the GaN-based semiconductor portion to form the semiconductor light generating device.

REFERENCES:
patent: 6552376 (2003-04-01), Koike et al.
patent: 6744071 (2004-06-01), Sano et al.
patent: 7049635 (2006-05-01), Sano et al.
patent: 2002/0155634 (2002-10-01), D'Evelyn et al.
patent: 2003/0141506 (2003-07-01), Sano et al.
patent: 11-68157 (1999-03-01), None
patent: 2001-60720 (2001-03-01), None
patent: 2001-77423 (2001-03-01), None
patent: 2001-119104 (2001-04-01), None
patent: 2001-148544 (2001-05-01), None
patent: 2003-100705 (2003-04-01), None
patent: WO 03-054937 (2003-07-01), None
D. Morita, et al. “High Output Power 365 nm Ultraviolet Light Emitting Diode of GaN-Free Structure” Jpn. J. Appl. Phys. vol. 41 (2002), Part 2, No. 12B, pp. L1434-L1436.
D. Mortia, et al. “Effect of Low-threading-dislocation-density GaN-Template on 365 nm UV-LED” 50th Conference of Japan Society of Applied Physics Extended Abstract, pp. 431.
Japanese Office Action for Corresponding Application No. 2004-171301 Dispatched Feb. 6, 2007.
Chinese Office Action issued in corresponding Chinese Patent Application No. 200410056340.2 dated May 11, 2007.
Japanese Office Action, with English translation, issued in Japanese Patent Application No. JP 2004-171301, mailed Feb. 12, 2008.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Light generating semiconductor device and method of making... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Light generating semiconductor device and method of making..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Light generating semiconductor device and method of making... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3945499

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.