Semiconductor device manufacturing: process – Making device or circuit emissive of nonelectrical signal
Reexamination Certificate
2011-08-23
2011-08-23
Smith, Matthew (Department: 2823)
Semiconductor device manufacturing: process
Making device or circuit emissive of nonelectrical signal
C257SE33001
Reexamination Certificate
active
08003414
ABSTRACT:
Methods of fabricating light emitting elements and light emitting devices, light emitting elements and light emitting devices are provided. In some embodiments, the methods of fabricating a light emitting element includes forming a buffer layer on at least one first substrate, bonding the at least one first substrate on a second substrate, wherein the buffer layer is placed between each of the first substrate and the second substrate and the second substrate is larger than the first substrate, exposing the buffer layer, and sequentially forming a first conductive layer, a light emitting layer, and a second conductive layer on the exposed buffer layer.
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Mills & Onello LLP
Samsung Electronics Co,. Ltd.
Shook Daniel
Smith Matthew
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