Light emitting element and manufacturing method thereof

Active solid-state devices (e.g. – transistors – solid-state diode – Incoherent light emitter structure – With reflector – opaque mask – or optical element integral...

Reexamination Certificate

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C257SE33003, C257SE33060, C257SE33068, C438S029000

Reexamination Certificate

active

07928460

ABSTRACT:
In a laser chip1using a nitride semiconductor having a hexagonal crystal structure, the −c plane is used as a first resonator facet A, which is the side of the laser chip1through which light is emitted. On the first resonator facet A, that is, on the −c plane, a facet protection film14is formed. This ensures firm joint between the first resonator facet A and the facet protection film14and alleviates deterioration of the first resonator facet A.

REFERENCES:
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patent: 2004/0251471 (2004-12-01), Dwilinski et al.
patent: 2005/0249255 (2005-11-01), Dwilinski et al.
patent: 2008/0050855 (2008-02-01), Dwilinski et al.
patent: 2008/0285609 (2008-11-01), Ohta et al.
patent: 1663088 (2005-08-01), None
patent: 2008-198952 (2008-08-01), None
patent: WO 2004/004085 (2004-01-01), None
Kuniyoshi Okamoto et al., “Continuous-Wave Operation ofm-Plane InGaN Multiple Quantum Well Laser Diodes,” Japanese Journal of Applied Physics, (JJAP Express Letter) vol. 46, No. 9, 2007, pp. L187-L189.

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