Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With window means
Reexamination Certificate
2004-09-21
2008-09-23
Weiss, Howard (Department: 2814)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With window means
C257S778000, C257S779000, C438S106000, C310S31300R
Reexamination Certificate
active
07427805
ABSTRACT:
An LED chip package body includes an LED chip having a pad-installed surface, a plurality of pads installed on the pad-installed surface and a rear surface formed on an opposite side of the pad-installed surface. A light-reflecting coating is disposed on the pad-installed surface and has a plurality of exposed holes for exposure of the corresponding pads. A first insulative layer is formed on the light-reflecting coating and has a plurality of through holes communicating with the corresponding exposed holes. A second insulative layer is disposed on the rear surface and has a central through hole for exposure of a central portion of the rear surface. A lens is received in the central through hole. Each of a plurality of external connected conductive bodies is electrically connected to the corresponding pad and projects out of the corresponding through hole in the first insulative layer.
REFERENCES:
patent: 6674159 (2004-01-01), Peterson et al.
patent: 2001/0009342 (2001-07-01), Furukawa et al.
patent: 2005/0023550 (2005-02-01), Eliashevich et al.
Rao Steven H
Rosenberg , Klein & Lee
Weiss Howard
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