Light-emitting diode assembly and method of fabrication

Details Light-emitting diode assembly and method of fabrication Light-emitting diode assembly and method of fabrication

2006-07-20

2009-10-06

Soward, Ida M (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Incoherent light emitter structure

With housing or contact structure

C257S098000, C257S675000, C257S706000, C257S707000, C257S712000, C257S930000, C257SE23051, C257SE23080, C257SE23113, C257SE25025, C257SE25032, C257SE31131, C257SE33001, C257SE33054, C257SE33075, C257SE33077, C257SE51018, C257SE51022

Reexamination Certificate

active

07598535

ABSTRACT:
An LED assembly includes a packaged LED module (30) and a heat dissipation device (50). The LED module includes at least an LED die therein and a plurality of conductive pins (32, 34) extending downwardly from a bottom portion thereof. The heat dissipation device is thermally and electrically connected with the at least an LED die. The heat dissipation device defines at least a mounting hole (542) therein. At least one of the conductive pins is fittingly received in the at least a mounting hole and thermally and electrically connects with the heat dissipation device.

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