Semiconductor device manufacturing: process – Bonding of plural semiconductor substrates
Reexamination Certificate
2006-05-16
2006-05-16
Crane, Sara (Department: 2811)
Semiconductor device manufacturing: process
Bonding of plural semiconductor substrates
C438S458000
Reexamination Certificate
active
07045438
ABSTRACT:
A semiconductor device in which degradation due to permeation of water and oxygen can be limited, e.g., a light emitting device having an organic light emitting device (OLED) formed on a plastic substrate, and a liquid crystal display using a plastic substrate. A layer to be debonded, containing elements, is formed on a substrate, bonded to a supporting member, and debonded from the substrate. A thin film is thereafter formed on the debonded layer. The debonded layer with the thin film is adhered to a transfer member. Cracks caused in the debonded layer at the time of debonding are thereby repaired. As the thin film in contact with the debonded layer, a film having thermal conductivity, e.g., film of aluminum nitride or aluminum nitroxide is used. This film dissipates heat from the elements and has the effect of preventing deformation and change in quality of the transfer member, e.g., a plastic substrate.
REFERENCES:
patent: 5206749 (1993-04-01), Zavracky et al.
patent: 5258325 (1993-11-01), Spitzer et al.
patent: 5317236 (1994-05-01), Zavracky et al.
patent: 5341015 (1994-08-01), Kohno
patent: 5376561 (1994-12-01), Vu et al.
patent: 5397713 (1995-03-01), Hamamoto et al.
patent: 5654811 (1997-08-01), Spitzer et al.
patent: 5674304 (1997-10-01), Fukada et al.
patent: 5757456 (1998-05-01), Yamazaki et al.
patent: 5781164 (1998-07-01), Jacobsen et al.
patent: 5807440 (1998-09-01), Kubota et al.
patent: 5821138 (1998-10-01), Yamazaki et al.
patent: 5851862 (1998-12-01), Ohtani et al.
patent: 5879741 (1999-03-01), Itoh
patent: 5929961 (1999-07-01), Nishi et al.
patent: 6033974 (2000-03-01), Henley et al.
patent: 6043800 (2000-03-01), Spitzer et al.
patent: 6059913 (2000-05-01), Asmussen et al.
patent: 6100166 (2000-08-01), Sakaguchi et al.
patent: 6118502 (2000-09-01), Yamazaki et al.
patent: 6127199 (2000-10-01), Inoue et al.
patent: 6221738 (2001-04-01), Sakaguchi et al.
patent: 6261634 (2001-07-01), Itoh
patent: 6268695 (2001-07-01), Affinito
patent: 6310362 (2001-10-01), Takemura
patent: 6320640 (2001-11-01), Nishi et al.
patent: 6362866 (2002-03-01), Yamazaki et al.
patent: 6372608 (2002-04-01), Shimoda et al.
patent: 6376333 (2002-04-01), Yamazaki et al.
patent: 6423614 (2002-07-01), Doyle
patent: 6448152 (2002-09-01), Henley et al.
patent: 6486041 (2002-11-01), Henley et al.
patent: 6492026 (2002-12-01), Graff et al.
patent: 6521511 (2003-02-01), Inoue et al.
patent: 6544430 (2003-04-01), McCormack et al.
patent: 6664169 (2003-12-01), Iwasaki et al.
patent: 6682990 (2004-01-01), Iwane et al.
patent: 6737285 (2004-05-01), Iketani et al.
patent: 6774010 (2004-08-01), Chu et al.
patent: 6781152 (2004-08-01), Yamazaki
patent: 6784113 (2004-08-01), Hembree
patent: 6790747 (2004-09-01), Henley et al.
patent: 6802926 (2004-10-01), Mizutani et al.
patent: 6815240 (2004-11-01), Hayashi
patent: 6875671 (2005-04-01), Faris
patent: 2001/0022362 (2001-09-01), Hayahi
patent: 2001/0040645 (2001-11-01), Yamazaki
patent: 2002/0004250 (2002-01-01), Iketani et al.
patent: 2002/0004292 (2002-01-01), Yamazaki et al.
patent: 2002/0048864 (2002-04-01), Yamazaki et al.
patent: 2003/0032210 (2003-02-01), Takayama et al.
patent: 2003/0047280 (2003-03-01), Takayama et al.
patent: 2003/0064569 (2003-04-01), Takayama et al.
patent: 2003/0082889 (2003-05-01), Maruyama et al.
patent: 2005/0017255 (2005-01-01), Yamazaki
patent: 1312590 (2001-09-01), None
patent: 1332471 (2002-01-01), None
patent: 1 122 794 (2001-08-01), None
patent: 05-347186 (1993-12-01), None
patent: 10-125929 (1998-05-01), None
patent: 10-125930 (1998-05-01), None
patent: 10-125931 (1998-05-01), None
patent: 2001-085154 (2001-03-01), None
patent: 2001-189460 (2001-07-01), None
patent: 2001-267578 (2001-09-01), None
patent: 3238223 (2001-12-01), None
patent: WO 92/12453 (1992-07-01), None
Toru Takayama et al.; “A CPU on a Plastic Film Substrate”;2004 Symposium on VLSI Technology Digest of Technical Papers; pp. 230-231;2004.
Maruyama Junya
Mizukami Mayumi
Takayama Toru
Yamazaki Shunpei
Crane Sara
Fish & Richardson P.C.
Semiconductor Energy Laboratory Co,. Ltd.
LandOfFree
Light emitting device, semiconductor device, and method of... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Light emitting device, semiconductor device, and method of..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Light emitting device, semiconductor device, and method of... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3590493