Lift pin for dechucking substrates

Coating apparatus – Gas or vapor deposition – With treating means

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Details

118715, 118719, 361143, 361144, 361145, 361225, 361230, 361233, 361234, 361235, 156345, 1566431, 307127, 307130, C23C 1600, H02N 1300

Patent

active

059000627

ABSTRACT:
A lift pin 95 for dechucking a substrate 15 held to a chuck 50 by residual electrostatic charge, the substrate being processed in a plasma formed using RF currents, is described. The lift pin 95 comprises (a) a movable elongated member 110 having a tip 115 suitable for lifting and lowering the substrate 15 off the chuck 50, and capable of forming an electrically conductive path between the substrate 15 and a current sink 105. The electrically conductive path comprises at least one of the following: (1) a frequency selective filter capable of filtering RF currents flowing therethrough so that substantially no RF currents flow through the filter; or (2) a resistor having a resistance sufficiently elevated to reduce the voltage caused by RF currents flowing therethrough, by at least about 50%. The lift pin 95 allows the residual electrostatic charge in the substrate 15 to be discharged to the current sink 105 substantially without allowing RF currents, used to form a plasma in the process chamber and to attract the plasma to the substrate, from flowing to the current sink 105.

REFERENCES:
patent: 4891087 (1990-01-01), Davis et al.
patent: 5350479 (1994-09-01), Collins et al.
patent: 5366002 (1994-11-01), Tepman
patent: 5459632 (1995-10-01), Birang et al.
patent: 5552955 (1996-09-01), Mashiro et al.
patent: 5612850 (1997-03-01), Birang et al.
patent: 5684669 (1997-11-01), Collins et al.
European Search Report Communication dated Jun. 2, 1998.

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