Lift pin actuating mechanism for semiconductor processing...

Material or article handling – Elevator or hoist and loading or unloading means therefor – Comprising means enabling additional movement of carrier or...

Reexamination Certificate

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Details

C414S652000, C414S935000

Reexamination Certificate

active

06767176

ABSTRACT:

FIELD OF THE INVENTION
The present invention relates to semiconductor manufacturing of thin substrates or wafers and, more particularly, to the transfer and loading of semiconductor wafers, glass plates and the like into and out of processing chambers.
BACKGROUND OF THE INVENTION
Semiconductor manufacturing generally requires that a number of different processes be applied to a substrate such as a wafer. Typically, each process is applied to a wafer in a different chamber dedicated to a respective process. Thus the manufacturing process involves not only a sequence of processes carried out in the respective chambers, but also transporting wafers among the processing chambers, and loading and unloading wafers into and out of the processing chambers. Most semiconductor processing is carried out in chambers configured to process one wafer at a time, in a very high vacuum capable environment. Thus, a process to be performed in a particular chamber cannot be carried out while wafers are being loaded into or removed from the processing chamber. Consequently, reducing the time required to load and unload wafers into and out of processing chambers is a significant factor in maximizing manufacturing throughput.
It is therefore desirable to provide for rapid and reliable transfer of wafers to and from processing chambers. It is also desirable that chamber components which aid in the transfer of wafers be simple and inexpensive to manufacture.
SUMMARY OF THE INVENTION
According to a first aspect of the invention, a lift pin/actuating assembly includes a lift pin and an actuating mechanism having an actuator configured to generate movement by the lift pin along a first axis, and a translation mechanism coupled to the actuator and configured to translate movement of the actuator along the first axis into movement by the lift pin along a second axis.
According to a second aspect of the invention, a method of operating a substrate lift pin includes applying vertical actuation to the pin, moving the pin vertically a first distance, contacting a vertical motion stop after moving the first distance, and translating further vertical actuation into horizontal movement of the pin.
According to a third aspect of the invention, a lift pin/actuating assembly for a semiconductor processing chamber includes a lift pin adapted to hold a semiconductor substrate in the processing chamber. Also included in the lift pin/actuating assembly are a base on which the lift pin is mounted, a first mechanism adapted to raise and lower the base, and a second mechanism adapted to convert vertical motion of the base into pivoting motion of the lift pin.
According to a fourth aspect of the invention, a method of operating a semiconductor processing chamber includes providing a lift pin, mounting the lift pin so that it extends upwardly into the processing chamber, lowering a base on which the lift pin is mounted, and converting the lowering motion of the base into pivoting motion of the lift pin.
Other objects, features and advantages of the present invention will become more fully apparent from the following detailed description of the preferred embodiments, the appended claims and the accompanying drawings.


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