Lift-off process for terminal metals

Details Lift-off process for terminal metals Lift-off process for terminal metals

1988-08-22

1989-08-29

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156655, 156656, 156664, 156668, 430315, 430317, 430318, 437203, 437228, B44C 122, B05D 306, B29C 3700, C23F 102

Patent

active

048614254

ABSTRACT:
A process is described for selective removal of unwanted metallization from the surface of a semiconductor device. The process comprises the usual deposition of a configurable image defining layer on the surface of the device upon which a suitable pad limiting metallurgy (PLM) has already been deposited. The layer is then opened over the pad limiting metallurgy using standard techniques and coated with a layer of the terminal metal. The coated device is then heated to just above the melting point of the terminal metal causing the melted metal, through surface tension to form a ball of metal on the PLM and to form small globules of metal on the surface of the layer and then permitted to cool. When cooled the layer is removed using the usual techniques. Because the coating of terminal metal is no longer a continuous layer on the surface of the mask, removal of the polymer mask can be accomplished in about one-tenth of the time required when compared to a deposited terminal metal layer that is not melted. Also because of the effects of surface tension the metal coating need only be one-half the thickness required under the prior art techniques.

REFERENCES:
patent: 4045594 (1977-08-01), Maddocks
patent: 4108717 (1978-08-01), Widmann
patent: 4428796 (1984-01-01), Milgram
patent: 4448636 (1984-05-01), Baber
patent: 4519872 (1985-05-01), Anderson, Jr. et al.
patent: 4532002 (1985-07-01), White

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