Lift-off process for depositing metal on a substrate

Details Lift-off process for depositing metal on a substrate Lift-off process for depositing metal on a substrate

1983-02-22

1985-02-05

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156652, 156653, 156656, 156657, 156668, 1566591, 204192E, 252 793, 427 88, 427272, 427282, 430314, 430317, 430318, C23F 102, B44C 122, C03C 1500, C03C 2506

Patent

active

044976844

ABSTRACT:
An improved method is set out for depositing a metal on a substrate to form a metal pattern. The method is particularly useful for the deposition of metal grids which form portions of microcircuits. The substrate is covered with a first sacrificial layer which is covered with a rigid second sacrificial layer which in turn is covered with a photoresist layer. The pattern which is to be deposited on the substrate is extended through the second sacrificial layer. Sufficient of the first sacrificial layer is removed to undercut the second sacrificial layer and to provide an overhanging lip portion of at least about 1000 .ANG. overhang and an enlarged pattern on the substrate. Metal is deposited on the enlarged pattern and the first sacrificial layer is then eliminated while the metal pattern is left behind on the substrate.

REFERENCES:
patent: 3849138 (1974-11-01), Grebe
patent: 3873361 (1975-03-01), Franco et al.
patent: 4202914 (1980-05-01), Havas et al.
patent: 4256816 (1981-03-01), Dunkleberger

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