Lift off patterning process on a flexible substrate

Details Lift off patterning process on a flexible substrate Lift off patterning process on a flexible substrate

1988-12-09

1990-10-23

Lacey, David L.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156633, 156634, 156664, 156666, 156668, 156902, 427 96, 427282, B44C 122, C25F 302, H05K 306

Patent

active

049649450

ABSTRACT:
A method of providing patterned, thin-film materials on flexible substrates by depositing a first, etchable, integral mask onto a substrate, depositing a second pattern material over the mask region and then removing the mask, such as by etching. Patterned films useful as printed circuits and the like can be prepared by this method. In an alternate embodiment, patterned particles can be prepared for dispersion in a vehicle or matrix using the described process.

REFERENCES:
patent: 3192136 (1965-06-01), Reid
patent: 3526573 (1970-09-01), Kepple
patent: 3540047 (1970-11-01), Walser et al.
patent: 3728177 (1973-04-01), Caule
patent: 4447292 (1984-05-01), Schuster-Woldon
patent: 4474845 (1984-10-01), Hagerman
patent: 4710263 (1987-12-01), Kato
Official Gazette, Oct. 20, 1987, p. 1578, Publication regarding U.S. Ser. No. 739,548 (U.S. Pat. No. 4,701,761 not issued).

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