Lid with variable solder layer for sealing semiconductor package

Details Lid with variable solder layer for sealing semiconductor package Lid with variable solder layer for sealing semiconductor package

1997-01-29

1998-10-13

Kincaid, Kristine L.

Electricity: conductors and insulators

Boxes and housings

Hermetic sealed envelope type

174 523, H05K 500

Patent

active

058214550

ABSTRACT:
A lid for sealing a semiconductor package containing a semiconductor chip, a semiconductor package making use of the lid, and a method for producing the lid. The lid has a solder layer along the peripheral side of a ceramic plate. The solder layer has a portion of an increased solder thickness and a portion of a reduced solder thickness extending along the peripheral direction. When sealing the semiconductor package, a gas confined within the inside of the semiconductor chip mounting site of the package substrate may be discharged from the semiconductor package for realizing hermetic sealing.

REFERENCES:
patent: 4356047 (1982-10-01), Gordon et al.
patent: 4626960 (1986-12-01), Hamano et al.
patent: 4746583 (1988-05-01), Falanga
patent: 5057376 (1991-10-01), Sunahara et al.
patent: 5414300 (1995-05-01), Tozawa et al.

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