4. Electricity: conductors and insulators
  5. Boxes and housings
  6. Hermetic sealed envelope type

Akihiro Hidaka

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Lid with variable solder layer for sealing semiconductor package

Electricity: conductors and insulators – Boxes and housings – Hermetic sealed envelope type
Patent

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Method of forming connector structure for a ball-grid array

Metal working – Method of mechanical manufacture – Electrical device making
Reexamination Certificate

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Profile ID: LFUS-PAI-P-523071

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