Lid wafer bond packaging and micromachining

Details Lid wafer bond packaging and micromachining Lid wafer bond packaging and micromachining

1996-08-29

1998-08-25

Tran, Minh-Loan

Active solid-state devices (e.g., transistors, solid-state diode

Responsive to non-electrical signal

Physical deformation

257433, 257704, 257787, H01L 2982

Patent

active

057985570

ABSTRACT:
A wafer level hermetically packaged integrated circuit has a protective cover wafer bonded to a semiconductor device substrate wafer. The substrate wafer may contain a cavity. The cover wafer seals integrated circuits and other devices including but not limited to air bridge structures, resonant beams, surface acoustic wave (SAW) devices, trimmable resistors, and micromachines. Some devices, such as SAWs, are formed on the surface of cavities formed in the protective cover wafer. Die are separated to complete the process.

REFERENCES:
patent: 5583373 (1996-12-01), Ball et al.
patent: 5610431 (1997-03-01), Martin

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