Lid assembly for a processing system to facilitate...

Details Lid assembly for a processing system to facilitate... Lid assembly for a processing system to facilitate...

2005-04-12

2005-04-12

Zervigon, Rudy (Department: 1763)

Coating apparatus

Gas or vapor deposition

C118S728000, C156S345290, C156S345330

Reexamination Certificate

active

06878206

ABSTRACT:
A lid assembly for a semiconductor processing system is provided. The lid assembly generally includes a lid having a gas manifold mounted on a first side and a baffle plate mounted on a second side. The gas manifold is configured to deliver a plurality of gases to a plenum defined between the baffle plate and the lid. The gases are mixed within a recess formed in the baffle plate before exiting into the processing system through a singular passage.

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