Lens support and wirebond protector

Details Lens support and wirebond protector Lens support and wirebond protector

2011-03-15

2011-03-15

Stark, Jarrett J (Department: 2823)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Having light transmissive window

C438S125000, C257S680000, C257S731000

Reexamination Certificate

active

07906372

ABSTRACT:
A wirebond protector has an elongated shape that corresponds to the elongated array of wirebonds along the edge of a microelectronic device that connect a semiconductor die to electrical conductors on a substrate. In making the microelectronic device with wirebond protection, wirebonds are first formed in the conventional manner The wirebond protector is then attached to the device in an orientation in which it extends along the array of wirebonds to at least partially cover the wirebonds.

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