4. Semiconductor device manufacturing: process
  5. Packaging or treatment of packaged semiconductor
  6. Having light transmissive window

David J. K. Meadowcroft

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Lens support and wirebond protector

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Having light transmissive window
Reexamination Certificate

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Lens support and wirebond protector

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Insulative housing or support
Reexamination Certificate

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Optical communications device having a mounting core and method

Optical waveguides – Integrated optical circuit
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2335405

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