LED package structure and manufacturing method, and LED...

Details LED package structure and manufacturing method, and LED... LED package structure and manufacturing method, and LED...

2006-04-21

2010-10-26

Tran, Minh-Loan T (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Incoherent light emitter structure

Encapsulated

C257S707000, C257SE33075

Reexamination Certificate

active

07821027

ABSTRACT:
An LED package includes a substrate having an electrically conductive portion and an electrically non-conductive portion composed of an oxide of the conductive portion; an LED mounted on the conductive portion and electrically connected to the conductive portion; a first electrode disposed on the non-conductive portion and electrically connected to the LED by a wire; and a second electrode disposed on the substrate and electrically connected to the LED.

REFERENCES:
patent: 3671819 (1972-06-01), Swanson
patent: 6874910 (2005-04-01), Sugimoto et al.
patent: 2005/0029535 (2005-02-01), Mazzochette et al.
patent: 2005/0184387 (2005-08-01), Collins et al.
patent: 2005/0199900 (2005-09-01), Lin et al.
patent: 2005/0211997 (2005-09-01), Suehiro et al.
patent: 2006/0006406 (2006-01-01), Kim et al.
patent: 2006/0071222 (2006-04-01), Yatsuda et al.
patent: 2007/0080360 (2007-04-01), Mirsky et al.

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