LED matrix substrate with convection holes

Active solid-state devices (e.g. – transistors – solid-state diode – Incoherent light emitter structure – Plural light emitting devices

Reexamination Certificate

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Details

C257S081000, C257S098000

Reexamination Certificate

active

06753553

ABSTRACT:

BACKGROUND OF THE INVENTION
1. Field of the Invention
This invention relates light emitting diode (LED) packages, particularly to the substrate of LED matrix packages.
2. Brief Description of Related Art
FIG. 1
shows a prior art substrate
10
for a LED matrix. On the substrate
10
are first group of printed circuits
11
with bonding pads
11
B, and second group of printed circuits
12
with bonding pads
12
B. Mounted on the first group of bonding pads
11
B are light emitting diodes (LED)
15
, each having a bottom electrode and a top electrode. Wire-bonded through wires
14
to the second group of bonding pads
12
B are the top electrodes of the LEDs
15
. This kind of substrate can only remove the heat generated in the LEDs
15
through the top surface, the bottom surface and the thin side edges. This kind of structure does not remove the heat efficiently.
SUMMARY OF THE INVENTION
An object of this invention is to provide efficient heat removal of an LED matrix. Another object of this invention is to increase the reliability of the LED matrix.
These objects are achieved by providing through holes in the substrate for air ventilation or convection. Fans may be used to force the air through these holes and to increase convection.


REFERENCES:
patent: 5355942 (1994-10-01), Conte
patent: 6121553 (2000-09-01), Shinada et al.
patent: 6383835 (2002-05-01), Hata et al.

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