Illumination – Plural light sources – With support
Reexamination Certificate
2009-07-08
2010-10-05
Tso, Laura (Department: 2875)
Illumination
Plural light sources
With support
C362S249040, C362S800000
Reexamination Certificate
active
07806560
ABSTRACT:
An illumination assembly includes a compliant substrate comprising a first and second electrically conductive foil separated by an electrically insulating layer. The insulating layer includes a polymer material loaded with particles that enhance thermal conductivity of the insulating layer. A plurality of LED dies are disposed on the first conductive foil.
REFERENCES:
patent: 6250774 (2001-06-01), Begemann et al.
patent: 6274224 (2001-08-01), O'Bryan et al.
patent: 6577492 (2003-06-01), O'Bryan et al.
patent: 6638378 (2003-10-01), O'Bryan et al.
patent: 6657297 (2003-12-01), Jewram et al.
patent: 6799902 (2004-10-01), Anderson et al.
patent: 2001/0001207 (2001-05-01), Shimizu et al.
patent: 2002/0113244 (2002-08-01), Barnett et al.
patent: 2003/0001488 (2003-01-01), Sundahl
patent: 2003/0063465 (2003-04-01), McMillan et al.
patent: 2003/0153099 (2003-08-01), Jiang et al.
patent: 2005/0116235 (2005-06-01), Schultz et al.
patent: 2005/0265029 (2005-12-01), Epstein et al.
patent: 2006/0012991 (2006-01-01), Weaver, Jr. et al.
patent: 2006/0098438 (2006-05-01), Ouderkirk et al.
patent: 2 622 896 (1991-06-01), None
patent: WO 2005/099323 (2005-10-01), None
Peiffer, Joel S., “Embedded Capacitor Material Evaluation”, Presented at IPC SMEMA Council APEXSM, www.GoApex.org, pp. 1-4, 2001.
Peiffer, Joel S., “Ultra-Thin, Loaded Epoxy Materials for Use as Embedded Capacitor Layers”, Thin Laminates, Printed Circuit Design & Manufacture, pp. 40-42, Apr. 2004.
Peiffer, Joel S., “The History of Embedded Distributed Capacitance”, Embedded Capacitance Patents, Printed Circuit Design & Manufacture, pp. 32-37, Aug. 2004.
Peiffer et al., “Electrical Performance Advantages of Ultra-Thin Dielectric Materials Used for Power-Ground Cores in High Speed, Multilayer Printed Circuit Boards”, http://multimedia.mmm.com/mws/mediawebserver.dyn?FFFFFFoMYRUF&i2Fsi2FFFdmNqBeeeeD-, Previously presented at IPC Expo 2003.
Xu et al., “Power-Bus Decoupling With Embedded Capacitance in Printed Circuit Board Design”, IEEE Transactions on Electromagnetic Compatibility, vol. 45, No. 1, Feb. 2003.
Murray Cameron T.
O'Bryan Nelson B.
Ouderkirk Andrew J.
Peiffer Joel S.
Schultz John C.
3M Innovative Properties Company
Tso Laura
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