LED chip package structure with high-efficiency...

Details LED chip package structure with high-efficiency... LED chip package structure with high-efficiency...

2008-09-29

2010-11-09

Mandala, Victor A (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Incoherent light emitter structure

Plural light emitting devices

C257S091000, C257S099000, C257SE33001, C257SE21001, C438S028000

Reexamination Certificate

active

07829901

ABSTRACT:
An LED chip package structure with high-efficiency light-emitting effect includes a substrate unit, a light-emitting unit, a package colloid unit, and a frame unit. The light-emitting unit has a plurality of LED chips electrically arranged on the substrate unit. The package colloid unit has a longitudinal package colloid covering the LED chips, and the longitudinal package colloid has a cambered colloid surface and a light-emitting colloid surface respectively formed on its top surface and a lateral surface thereof. The frame unit that is a frame layer covering the substrate unit and disposed around a lateral side of the longitudinal package colloid for exposing the light-emitting colloid surface of the longitudinal package colloid.

REFERENCES:
patent: 6921926 (2005-07-01), Hsu
patent: 2004/0061433 (2004-04-01), Izuno et al.
patent: 2006/0138436 (2006-06-01), Chen et al.
patent: 2006/0157724 (2006-07-01), Fujita
patent: 2009/0128732 (2009-05-01), Hamada

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