Leadless plastic chip carrier and method of fabricating same

Details Leadless plastic chip carrier and method of fabricating same Leadless plastic chip carrier and method of fabricating same

2005-09-26

2008-08-12

Clark, S. V. (Department: 2823)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Making plural separate devices

C438S124000, C438S122000, C257S675000, C257S707000

Reexamination Certificate

active

07410830

ABSTRACT:
A process for fabricating a leadless plastic chip carrier includes providing a leadframe including a plurality of contacts circumscribing a void; fixing a heat sink to the contacts of the leadframe using an intermediate non-electrically conductive adhesive such that the heat sink spans the void; mounting a semiconductor die to the heat sink in the void; wire bonding ones of the contacts to the pads of the semiconductor die; encapsulating the semiconductor die and the wire bonds in a molding material and singulating the leadless plastic chip carrier.

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