Leadless IC socket

Details Leadless IC socket Leadless IC socket

1999-09-27

2000-09-05

Hardy, David

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

257726, 257727, 439 71, H01L 2302, H01L 2334

Patent

active

061147575

ABSTRACT:
A leadless IC or other electronic circuit package socket is provided which is of simple construction providing low profile mounting of an IC package on a circuit board. The socket comprises a relative thin socket carrier having a plurality of resilient conductive columns extending between the top and bottom surfaces of the carrier and having alignment elements which are cooperative with elements on a circuit board on which the carrier is mounted to position the carrier on the circuit board such that the conductive columns are in registration and electrical contact with corresponding ones of contacts on the circuit board. An IC package or other circuit package has contacts on the bottom surface thereof in a pattern corresponding to the pattern of the resilient conductive columns of the socket carrier, and also has alignment elements cooperative with elements on the socket carrier to provide alignment of the package contacts and the conductive columns when the package is mounted on the socket carrier. A cover fits over the IC package and has snap fittings which engage cooperative openings or other elements of the circuit board to retain the IC package in electrical engagement with the circuit board via the socket carrier.

REFERENCES:
patent: 4099615 (1978-07-01), Lemke et al.
patent: 4417777 (1983-11-01), Bamford
patent: 4679318 (1987-07-01), Bright
patent: 4702706 (1987-10-01), Sadigh-Behzadi
patent: 5052101 (1991-10-01), Bright et al.
patent: 5322446 (1994-06-01), Cearley-Cabbiness
patent: 5567177 (1996-10-01), Foerstel et al.
patent: 5658153 (1997-08-01), Ikeya et al.

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