Leadless chip carrier apparatus providing an improved transmissi

Electricity: electrical systems and devices – Safety and protection of systems and devices – With specific current responsive fault sensor

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

357 81, 357 68, 357 80, 361414, H01L 2314, H01L 2340, H01L 2348, H01L 2304

Patent

active

045517460

ABSTRACT:
A carrier apparatus (40) for mounting logic components on the surface of a circuit board (41). The carrier apparatus (40) includes a housing structure defining top and bottom surfaces and further defining a cavity (50) in the bottom surface for receipt of a logic component (51). A recessed cover portion (56) is attached to the housing so as to enclose the cavity (50) thereby effectively sealing the logic component (51) in the housing. The carrier apparatus (40) includes means for mounting the housing on a circuit board such that the cover (56) does not make contact with the surface of the circuit board (41). The housing further includes means for electrically interconnecting the logic component (51) to the circuit board (41).
In yet another embodiment, a carrier apparatus (100) for mounting logic components on the surface of a circuit board (41) is disclosed which utilize ground and voltage planes together with alternating signal (118) and AC ground (121) traces so as to effectuate coplanar/strip-line and coplanar/microstrip transmission line environments along portions of the signal traces (118). Consequently, this results in signal lines having a controlled impedance environment and minimized crosstalk between neighboring signal leads lying in the same plane.

REFERENCES:
patent: Re30604 (1981-05-01), Kowalski
patent: 3157857 (1964-11-01), Stapper, Jr. et al.
patent: 3312878 (1967-04-01), Poch et al.
patent: 3617817 (1971-11-01), Kawakatsu et al.
patent: 3777221 (1973-12-01), Tatusko et al.
patent: 3895435 (1975-07-01), Turner et al.
patent: 3905038 (1975-09-01), Beyerlein
patent: 3943556 (1976-03-01), Wilson
patent: 4007479 (1977-02-01), Kowalski
patent: 4023053 (1977-05-01), Shimizu et al.
patent: 4028722 (1977-06-01), Helda
patent: 4054939 (1977-10-01), Ammon
patent: 4067041 (1978-01-01), Hutson
patent: 4099200 (1978-07-01), Koutalides
patent: 4109096 (1978-08-01), Dehaine
patent: 4112196 (1978-09-01), Selig et al.
patent: 4204218 (1980-05-01), Fox et al.
patent: 4250520 (1981-02-01), Denlinger
patent: 4257061 (1981-03-01), Chapel et al.
patent: 4288841 (1981-09-01), Gogal
patent: 4322778 (1982-03-01), Barbour et al.
patent: 4323914 (1982-04-01), Berndlmaier et al.
patent: 4329642 (1982-06-01), Luthi et al.
patent: 4332341 (1982-06-01), Minetti
patent: 4338621 (1982-07-01), Braun
patent: 4366342 (1983-01-01), Demnianiuk
patent: 4368503 (1983-01-01), Kurosawa et al.
patent: 4381131 (1983-04-01), Breedlove
patent: 4453176 (1984-01-01), Chance et al.
Brochure entitled, "Kyocera Packaging", Catalog No. 15T7908 Ft, published by Kyocera International, Inc.
Publication, "Joint Electron Device Engineering Counsel" (JEDEC) 95, Section 9.4, pp. 9.452-9.457 dated Oct. 6, 1980.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Leadless chip carrier apparatus providing an improved transmissi does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Leadless chip carrier apparatus providing an improved transmissi, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Leadless chip carrier apparatus providing an improved transmissi will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-298206

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.