Leadless alloy for soldering

Details Leadless alloy for soldering Leadless alloy for soldering

1998-01-20

1999-11-09

Ip, Sikyin

Alloys or metallic compositions

Tin base

Copper containing

420562, B23K 3526, C22C 1302

Patent

active

059808225

ABSTRACT:
A leadless alloy for soldering containing 0.1 to 5.0% bismuth, 0.1 to 5.0% silver, 0.1 to 3.0% antimony, 0.1 to 5.5% copper, 0.001 to 0.01% phosphorus, 0.01 to 0.1% germanium and 81.4 to 99.6% tin by weight.

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