Leadframe processing for molded package arrangements

Details Leadframe processing for molded package arrangements Leadframe processing for molded package arrangements

1993-03-30

1994-07-12

Powell, William

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156645, 156634, 156656, 156902, 437220, 437224, B44C 122, C23F 100

Patent

active

053285522

ABSTRACT:
A method for processing a leadframe for use with a molded package is disclosed. In particular, the method is suited for arrangements where direct wirebond attachment sites are exposed through the molding material. Conventional molding processes usually result in leaving a residue of molding material on the exposed wirebond sites. The invention is directed to including a protective layer of material over the wirebond locations during the leadframe plating operation. The protective layer (and any molding residue covering the protective layer) may then be removed using an etchant after the molding operation, exposing the underlying wirebond contact sites.

REFERENCES:
patent: 4410469 (1983-10-01), Katagiri et al.
patent: 4911519 (1990-03-01), Burton et al.
patent: 5026669 (1991-06-01), Shinohara

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