Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate
2009-09-24
2011-12-27
Trinh, Hoa B (Department: 2893)
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
C257SE23031, C257S736000
Reexamination Certificate
active
08084848
ABSTRACT:
A leadframe for a leadframe type package includes a chip base, and leads constituting lead lanes. One lead lane includes a pair of first differential signal leads, a pair of second differential signal leads, a pair of third differential signal leads between which and the pair of first differential signal leads is arranged the pair of second differential signal leads, a first power lead arranged between the pair of first and second differential signal leads, a second power lead arranged between the pair of second and third differential signal leads, and a third power lead between which and the second power lead is the pair of third differential signal leads. A voltage provided by the first power lead is less than a voltage provided by the second power lead, and the voltage provided by the second power lead is substantially equal to a voltage provided by the third power lead.
REFERENCES:
patent: 2008/0290486 (2008-11-01), Chen et al.
patent: 2010/0032818 (2010-02-01), Pilling et al.
patent: I244189 (2005-11-01), None
patent: I278087 (2007-04-01), None
Chinese Examination Report of Taiwan Application No. 098122240, dated Jan. 6, 2011.
J.C. Patents
Trinh Hoa B
VIA Technologies Inc.
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