Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With heat sink means
Patent
1998-05-12
2000-06-13
Williams, Alexander O.
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
With heat sink means
257712, 257680, 257774, 257666, 257690, 257713, 257707, H01L 2348, H01L 2302, H01L 23455
Patent
active
060752823
ABSTRACT:
The semiconductor device includes, inside a package, a leadframe having a central plate for housing a chip forming an integrated circuit, and a plurality of connection leads placed around the central plate and projecting outside the package. Internal connection wires are also included and which have, in the case of some of them, an end bonded to the central plate. The central plate has several through-passages made in a peripheral region of the central plate. Each of these through-passages lies approximately in the extension of a connection lead. The ends of the earth or ground wires bonded to the central plate lie near at least some of these through-passages.
REFERENCES:
patent: 4862246 (1989-08-01), Masuda et al.
patent: 5200809 (1993-04-01), Kwon
patent: 5225710 (1993-07-01), Westerkamp
patent: 5291060 (1994-03-01), Shimizu et al.
patent: 5345106 (1994-09-01), Doering et al.
patent: 5378924 (1995-01-01), Liang
patent: 5381042 (1995-01-01), Lerner et al.
patent: 5397917 (1995-03-01), Ommen et al.
patent: 5430250 (1995-07-01), Kwon
patent: 5430331 (1995-07-01), Hamzehdoost et al.
patent: 5442234 (1995-08-01), Liang
patent: 5489805 (1996-02-01), Hackitt et al.
patent: 5576577 (1996-11-01), Takenouchi et al.
patent: 5641987 (1997-06-01), Lee
patent: 5683944 (1997-11-01), Joiner et al.
patent: 5783860 (1998-07-01), Jeng et al.
patent: 5838064 (1998-11-01), Shimada et al.
patent: 5859477 (1999-01-01), Fehr
patent: 5869883 (1999-02-01), Mehringer et al.
patent: 5872395 (1999-02-01), Fujimoto
patent: 5874773 (1999-02-01), Terada et al.
patent: 5920119 (1999-07-01), Tamba et al.
patent: 5929514 (1999-07-01), Yalamanchili
Patent Abstracts of Japan, vol. 017, No. 484 (E-1426), Sep. 2, 1993 (JP 05121632).
Patent Abstracts of Japan, vol. 017, No. 538 (E-1440), Sep. 28, 1993 (JP 05152488).
Patent Abstracts of Japan, vol. 016, No. 215 (E-1204), May 20, 1992 (JP 04037050).
Patent Abstracts of Japan, vol. 017, No. 702 (E-1482), Dec. 21, 1993 (JP 05243474).
Patent Abstracts of Japan, vol. 011, No. 325 (E-551), Oct. 22, 1987 (JP 62112356).
Patent Abstracts of Japan, vol. 007, No. 258 (E-211), Nov. 17, 1983 (JP 58143558).
Galanthay Theodore E.
SGS-Thomson Microelectronics S.A.
Williams Alexander O.
LandOfFree
Leadframe for a semiconductor device and associated method does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Leadframe for a semiconductor device and associated method, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Leadframe for a semiconductor device and associated method will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2070673