Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate
2008-05-20
2008-05-20
Potter, Roy (Department: 2822)
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
C257S678000
Reexamination Certificate
active
11406357
ABSTRACT:
A semiconductor package includes a plurality of first leads, each with a top outer portion removed from the lead and an outer end, and a plurality of second leads, each with a bottom outer portion removed from the lead and an outer end. The first and second leads alternate with each other along an edge of the package. Also, the outer ends of the first leads form a first row along the edge of the package and the outer ends of the second leads form a second row along the edge of the package. In one embodiment, the first and second rows are parallel to each other and an encapsulant covers at least a portion of the first and second leads.
REFERENCES:
patent: 6326687 (2001-12-01), Corisis
patent: 6943450 (2005-09-01), Fee et al.
Retuta Danny Vallejo
Sun Anthony Yi Sheng
Tan Hien Boon
Tan Soon Huat James
Tanary Susanto
Potter Roy
Sughrue & Mion, PLLC
United Test and Assembly Center Ltd.
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