Semiconductor device manufacturing: process – With measuring or testing
Reexamination Certificate
2006-07-11
2006-07-11
Gurley, Lynne A. (Department: 2812)
Semiconductor device manufacturing: process
With measuring or testing
C438S015000, C438S016000, C438S612000, C438S613000, C438S614000, C257S772000, C257S779000
Reexamination Certificate
active
07074627
ABSTRACT:
A solder system includes a lead (Pb) indicator and a solder flux. A method for forming a semiconductor device includes providing a carrier, applying the solder system to the carrier, coupling the terminal to the carrier via the solder system, melting the solder system to attach the terminal to the carrier and form a completed semiconductor device, and determining if the completed semiconductor device has a different predetermined property from the solder system.
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“Lead Check Swabs,” from http://www.professionalequipment.com email signup, Jun. 14, 2004, pp. 1-2.
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Tippy Wicker, New Technologies Product Feature LF Green Solder Paste, Qualitek, www.qualitek.com/technology.html.
Burnette Terry E.
Koschmieder Thomas H.
Freescale Semiconductor Inc.
Gurley Lynne A.
Vo Kim-Marie
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