Lead pin with Au-Ge based brazing material

Details Lead pin with Au-Ge based brazing material Lead pin with Au-Ge based brazing material

2005-09-13

2005-09-13

Kang, Donghee (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With bumps on ends of lead fingers to connect to semiconductor

C257S674000, C257S677000, C257S767000

Reexamination Certificate

active

06943435

ABSTRACT:
A lead pin with an Au—Ge based brazing material including a lead pin made of a copper-containing metal is provided. The lead pin including a joining surface to a substrate, at least the joining surface of the lead pin being plated with nickel and gold, and including an Au—Ge based brazing material being fused on top of the gold plating, wherein the lead pin after plated with nickel is subjected to heat-treatment and then plated with gold to fuse the brazing material.

REFERENCES:
patent: 3941916 (1976-03-01), Morse
patent: 5442145 (1995-08-01), Imai et al.
patent: 6268017 (2001-07-01), Takeuchi et al.
patent: 6359332 (2002-03-01), Shiraishi
patent: 2001/0015491 (2001-08-01), Shiraishi
patent: 62-113457 (1987-05-01), None
patent: 04-273468 (1992-09-01), None
patent: WO 89/04740 (1989-06-01), None

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