Metal fusion bonding – Including means to apply flux or filler to work or applicator – By partial or total immersion of work or applicator into liquid
Patent
1995-06-07
1996-10-22
Heinrich, Samuel M.
Metal fusion bonding
Including means to apply flux or filler to work or applicator
By partial or total immersion of work or applicator into liquid
228260, 277135, 415230, B23K 306
Patent
active
055668755
ABSTRACT:
A lead oxide preventing apparatus for an automatic soldering device does not generate lead oxides around an impeller shaft inside a lead chamber. Industrial waste in the form of heavy-metal-contaminated material is reduced by installing a ring member and by placing an oxidation preventing agent into the ring members, or by installing a beating therein so that the molten lead does not contact portions of the impeller shaft.
REFERENCES:
patent: 4437605 (1984-03-01), Tucker et al.
patent: 4700878 (1987-10-01), Ciniglio
Heinrich Samuel M.
Samsung Electronics Co,. Ltd.
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