Lead on chip semiconductor memory device with multiple bit confi

Details Lead on chip semiconductor memory device with multiple bit confi Lead on chip semiconductor memory device with multiple bit confi

1997-11-19

1999-03-09

Chaudhuri, Olik

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Configuration or pattern of bonds

257686, 257666, H01L 2348, H01L 2352, H01L 2940

Patent

active

058805311

ABSTRACT:
A semiconductor memory device having inner lead portions of a plurality of leads disposed through at least one insulating film on a semiconductor chip and electrically insulated from the semiconductor chip, includes bonding pads for at least data input/output arranged in two rows axially symmetrically in a substantially central portion of the semiconductor chip interposed between memory arrays and bonding wires for connecting the inner lead portions and the bonding pads.

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