Lead grounding

Details Lead grounding Lead grounding

1982-03-18

1984-06-05

Truhe, J. V.

Electricity: conductors and insulators

Boxes and housings

Hermetic sealed envelope type

29879, 29884, 339 14R, 357 65, 357 74, 174 506, 174 51, H05K 504

Patent

active

044530331

ABSTRACT:
A microcircuit package in which one or more leads can be grounded to the package by a simple procedure which is performed on a package of usual construction. A braze preform is placed over a lead to be grounded, a metal washer is disposed over the lead and preform, and the assembly is brazed to cause fusing of the washer to the lead and to the header to provide a low resistance grounding connection between the lead and package.

REFERENCES:
patent: 3311798 (1967-03-01), Gray
patent: 3548076 (1970-12-01), Cooke

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