Lead-free tin alloy electroplating compositions and methods

Details Lead-free tin alloy electroplating compositions and methods Lead-free tin alloy electroplating compositions and methods

2011-06-28

2011-06-28

Geyer, Scott B (Department: 2812)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S660000, C438S674000, C205S252000

Reexamination Certificate

active

07968444

ABSTRACT:
Disclosed are electrolyte compositions for depositing a tin alloy on a substrate. The electrolyte compositions include tin ions, ions of one or more alloying metals, a flavone compound and a dihydroxy bis-sulfide. The electrolyte compositions are free of lead and cyanide. Also disclosed are methods of depositing a tin alloy on a substrate and methods of forming an interconnect bump on a semiconductor device.

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