Alloys or metallic compositions – Tin base – Antimony – or bismuth containing
Reexamination Certificate
2007-10-16
2007-10-16
Ip, Sikyin (Department: 1742)
Alloys or metallic compositions
Tin base
Antimony, or bismuth containing
C148S400000, C148S023000, C148S026000
Reexamination Certificate
active
10533288
ABSTRACT:
The present invention provides a Sn—Zn based lead-free solder which can prevent peeling of solder from soldered portions even after the passage of long periods after soldering of portions to be soldered made of Cu. A Sn—Zn based lead-free solder according to the present invention comprises 5-10 mass percent of Zn, a total of 0.005-1.0 mass percent of at least one substance selected from the group consisting of Au, Pt, Pd, Fe, and Sb, optionally a total of at most 15 mass percent of at least one substance selected from the group consisting of Bi and In, and a remainder of Sn. This Sn—Zn based lead-free solder can be made into a solder paste using a rosin flux containing a halide such as an amine hydrochloride as an activator.
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Hirata Masahiko
Nagashima Takashi
Ohnishi Tsukasa
Taguchi Toshihiko
Toyoda Yoshitaka
Ip Sikyin
Matsushita Electric Industrial Co. Ltd
Senju Metal Industry Co. Ltd.
Tobias Michael
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