Lead-free solder alloy and a manufacturing process of...

Specialized metallurgical processes – compositions for use therei – Compositions – Loose particulate mixture containing metal particles

Reexamination Certificate

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C148S024000, C420S562000

Reexamination Certificate

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06984254

ABSTRACT:
A lead-free solder powder that can include a plurality of lead-free solder particles each having a general spherical shape with a diameter of 20–60 μm. Each of the lead-free solder particles can contain Sn, Ag and Bi, with respective concentrations set such that the lead-free solder alloy has a melting temperature lower than a predetermined heat-resistant temperature of a work to be soldered.

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