Specialized metallurgical processes – compositions for use therei – Compositions – Loose particulate mixture containing metal particles
Reexamination Certificate
2006-01-10
2006-01-10
King, Roy (Department: 1742)
Specialized metallurgical processes, compositions for use therei
Compositions
Loose particulate mixture containing metal particles
C148S024000, C420S562000
Reexamination Certificate
active
06984254
ABSTRACT:
A lead-free solder powder that can include a plurality of lead-free solder particles each having a general spherical shape with a diameter of 20–60 μm. Each of the lead-free solder particles can contain Sn, Ag and Bi, with respective concentrations set such that the lead-free solder alloy has a melting temperature lower than a predetermined heat-resistant temperature of a work to be soldered.
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Fukushima Yumiko
Moriya Yasuo
Nemoto Yoshinori
Takesue Masakazu
Arent & Fox PLLC
Fujitsu Limited
King Roy
Wilkins, III Harry D.
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