Lead-free, nickel-free and cyanide-free plating finish for semic

Details Lead-free, nickel-free and cyanide-free plating finish for semic Lead-free, nickel-free and cyanide-free plating finish for semic

1998-08-28

1999-08-10

Jones, Deborah

Stock material or miscellaneous articles

All metal or with adjacent metals

Composite; i.e., plural, adjacent, spatially distinct metal...

257706, 420485, 357 71, B32B 1501

Patent

active

059357193

ABSTRACT:
A leadframe and method of fabrication of the leadframe. A leadframe is formed from one of copper or copper-based material and a coating of palladium is formed over the leadframe. Optionally, a layer of from about 10 to about 95 percent copper by weight and the remainder palladium is deposited between the leadframe and the coating of palladium. The coating of palladium is from about 3 to about 10 microinches and preferably about 3 microinches. The palladium/copper layer is from about 5 to about 40 microinches and preferably about 10 microinches. A semiconductor device is fabricated by providing a copper or copper-based lead frame and forming a layer of palladium over the leadframe. Optionally, a layer of palladium and copper is formed between the leadframe and the layer of palladium.

REFERENCES:
patent: 5650663 (1997-07-01), Parthasarathi

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