Lead-free interconnection for electronic devices

Details Lead-free interconnection for electronic devices Lead-free interconnection for electronic devices

1998-08-14

2000-10-03

Everhart, Caridad

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

438610, 228121, 228264, H01L 2144

Patent

active

061272531

ABSTRACT:
An electronic device that is equipped with a plurality of bonding pads positioned on the device for making electrical interconnections and electrically conductive composite bumps adhered to the bonding pads wherein the bumps are formed of a composite material consisting of a thermoplastic polymer and at least about 30 volume percent of conductive metal particles based on the total volume of the metal particles and the thermoplastic polymer. The present invention is also directed to a method of making electrical interconnections to an electronic device by pressing a plurality of composite bumps of a polymeric based material against a substrate having an electrically conductive surface by mechanical means under a sufficient temperature and/or a sufficient pressure. The present invention is further directed to a method of debonding an electronic device bonded by a composite binder by first providing an electronic device that is bonded by composite bumps consists of a thermoplastic polymer and at least about 30 volume percent of conductive metal particles and then exposing the composite bumps to a solvent or to a temperature not less than about 50%.degree. C. below the glass transition temperature of the composite bump.

REFERENCES:
patent: 5583747 (1996-12-01), Baird et al.
patent: 5707000 (1998-01-01), Olson et al.
patent: 5854514 (1998-12-01), Roldan et al.

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