Lead frame with electrostatic discharge protection

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support

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Details

438106, 438121, 438127, H01L 2144, H01L 2148, H01L 2150

Patent

active

058917608

ABSTRACT:
A lead frame having protection against electrostatic discharge is disclosed. The lead frame having protection against electrostatic discharge includes a multiplicity of leads and an electrostatic discharge protection device. The electrostatic discharge protection device includes a conductive layer and a protection layer. The protection layer is arranged to contact a plurality of leads and is formed from an electrostatic discharge protection material, which insulates the leads from the conductive layer at voltages below a predefined threshold voltage and establishes an electrical connection between the leads and the conductive layer at voltages above the threshold voltage.

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