4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Housing or package
  6. Insulating material

Randy Hsiao-Yu Lo

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Electrostatic discharge protection package

Electricity: electrical systems and devices – Safety and protection of systems and devices – High voltage dissipation
Patent

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Flip-chip ball grid array package with a heat slug

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Patent

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Lead frame with electrostatic discharge protection

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Patent

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Lead frame with electrostatic discharge protection

Active solid-state devices (e.g. – transistors – solid-state diode – Contacts or leads including fusible link means or noise...
Patent

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Profile ID: LFUS-PAI-P-1161228

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