Lead frame structure for preventing the warping of semiconductor

Details Lead frame structure for preventing the warping of semiconductor Lead frame structure for preventing the warping of semiconductor

1999-02-16

2000-06-20

Clark, Sheila V.

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With structure for mounting semiconductor chip to lead frame

257666, H01L 23495

Patent

active

060780991

ABSTRACT:
A lead frame structure can prevent the warping of a semiconductor package body. The lead frame has a downset die pad and upset internal leads so that packaging material can be evenly distributed both above and below the lead frame.

REFERENCES:
patent: 5172214 (1992-12-01), Casto
patent: 5291059 (1994-03-01), Ishitsuka et al.

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