Lead frame structure for IC devices with strengthened encapsulat

Details Lead frame structure for IC devices with strengthened encapsulat Lead frame structure for IC devices with strengthened encapsulat

1995-04-10

1997-05-27

Mantel, William

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

257672, 257676, 257677, H01L 23495

Patent

active

056335288

ABSTRACT:
This invention relates to lead flames upon which chips (A or B) are mounted prior to encapsulation during IC device packaging. A lead frame structure (6) for manufacturing an IC device comprises a lead frame base (1) including a plurality of leads (10) and four first tie bar portions (16) extending toward a die pad aperture (17). A die pad (2) forms a cross-shaped mounting surface (20) for receiving a chip (30), wherein the mounting surface (20) is smaller than the chip (30), such that perimeter surfaces of the chip (30) are substantially exposed when the chip (30) is mounted on the mounting surface (20). Four second tie bar portions (21) extend from the mounting surface (20) and correspond to the four first tie bar portions (16). The die pad (2) is affixed to the lead frame base (1) and positioned in the aperture (17) by affixing each of the first tie bar portions (16) to a corresponding one of the second tie bar portions (21).

REFERENCES:
patent: 4868635 (1989-09-01), Frechette et al.
patent: 5196268 (1993-03-01), Fritz
patent: 5204287 (1993-04-01), McLellan et al.
patent: 5294827 (1994-03-01), Mashane
patent: 5367191 (1994-11-01), Ebihara

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