Lead frame structure for IC devices with strengthened encapsulat

Details Lead frame structure for IC devices with strengthened encapsulat Lead frame structure for IC devices with strengthened encapsulat

1994-05-25

1995-07-04

Picardat, Kevin M.

Fishing, trapping, and vermin destroying

437209, 437211, 437214, 437219, 437220, H01L 2160

Patent

active

054299926

ABSTRACT:
This invention relates to lead frames upon which chips (A or B) are mounted prior to encapsulation during IC device packaging. A lead frame structure (6) for manufacturing an IC device comprises a lead frame base (1) including a plurality of leads (10) and four first tie bar portions (16) extending toward a die pad aperture (17). A die pad (2) forms a cross-shaped mounting surface (20) for receiving a chip (30), wherein the mounting surface (20) is smaller than the chip (30), such that perimeter surfaces of the chip (30) are substantially exposed when the chip (30) is mounted on the mounting surface (20). Four second tie bar portions (21) extend from the mounting surface (20) and correspond to the four first tie bar portions (16). The die pad (2) is affixed to the lead frame base (1) and positioned in the aperture (17) by affixing each of the first tie bar portions (16) to a corresponding one of the second tie bar portions (21).

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