Lead frame, semiconductor chip package using the lead frame,...

Details Lead frame, semiconductor chip package using the lead frame,... Lead frame, semiconductor chip package using the lead frame,...

2005-02-02

2008-10-14

Nguyen, Dao H (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With structure for mounting semiconductor chip to lead frame

C257S666000, C257S667000, C257SE23037, C257SE23039

Reexamination Certificate

active

07436049

ABSTRACT:
A semiconductor chip package with a lead frame having a plurality of leads formed along four sides of the lead frame and tie bars extending from an edge of each of the four sides, wherein bottom surfaces of the tie bars are recessed, a semiconductor chip which is adhered to the recessed surfaces of the tie bars, connectors which electrically connect a plurality of chip pads formed on an upper surface of the semiconductor chip with the plurality of leads, and an encapsulant which encapsulates the upper surface of the semiconductor chip, the connector and bonding portions of the connector.

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Korean Office Action dated Dec. 26, 2005 and English translation.
German Office Action dated Oct. 5, 2005 (with English-language translation).
Chinese Office Action dated Oct. 19, 2007, for corresponding Chinese Patent Application No. 200510006237.1 (with English-language translation).

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