Lead frame lead located for wire bonder

Details Lead frame lead located for wire bonder Lead frame lead located for wire bonder

1989-10-03

1992-03-17

Smith, Jerry

Boots, shoes, and leggings

228 45, 228105, G05B 1918

Patent

active

050974068

ABSTRACT:
A lead frame locater is used to locate actual positions of lead frame leads in respect to the semiconductor chip to provide accurate wire bonding of the semiconductor chip to the lead frame leads.

REFERENCES:
patent: 4763827 (1988-08-01), Watanabe et al.
patent: 4851902 (1989-07-01), Tezuka et al.
patent: 4896418 (1990-01-01), Yearsley
patent: 4972311 (1990-11-01), Holdgrafer et al.

Affiliated with

Also associated with

Rating

Lead frame lead located for wire bonder does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Lead frame lead located for wire bonder, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Lead frame lead located for wire bonder will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1480933