Lead frame including an inductor or other such magnetic componen

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

Patent

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Details

257676, 257924, H01L 2348

Patent

active

054282454

ABSTRACT:
A lead frame for use in an integrated circuit package is disclosed herein. The lead frame includes a magnetic component winding wherein the winding is formed as an integral part of the lead frame. Additional windings may be formed as an integral part of the lead frame and then folded into position over the first winding to form a multiple layered magnetic component winding. In one embodiment, the lead frame based winding is coated with a magnetic material to form a lead frame based inductor. There is also disclosed a method of producing a lead frame including a magnetic component winding wherein the winding is formed as an integral part of the lead frame.

REFERENCES:
patent: 4064472 (1977-12-01), Gunewardena et al.

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