Lead frame having small pitch between outer leads

Details Lead frame having small pitch between outer leads Lead frame having small pitch between outer leads

1994-05-03

1996-01-23

Limanek, Robert P.

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

257667, 257669, 257787, H01L 23495, H01L 2328

Patent

active

054867223

ABSTRACT:
A lead frame in which a bulgy portion is disposed to each of inner leads or outer leads at a position corresponding to a mold line, whereby a lead gap in the portion is defined as less than 0.15 mm.
The lead frame has such a shape as causing less resin leakage upon applying resin molding to a packaging main body upon preparing an IC plastic package. This enables to improve the yield in preparing the IC plastic package and reduce the manufacturing cost.

REFERENCES:
patent: 4331740 (1982-05-01), Burns
patent: 4496965 (1985-01-01), Orcutt et al.
patent: 5150193 (1992-09-01), Yasuhara et al.
patent: 5150194 (1992-09-01), Brooks et al.

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