Lead frame having dummy leads

Details Lead frame having dummy leads Lead frame having dummy leads

1993-11-30

1995-11-21

Jackson, Jerome

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

257675, H01L 2348, H01L 2946, H01L 2954

Patent

active

054689910

ABSTRACT:
A lead frame for a semiconductor device used in a vertically surface-mounted package which has internal leads gathered on one side thereof includes separately formed dummy leads attached to a semiconductor chip on the opposite side of the lead frame to avoid an inconsistent inflow pressure of a molding material during a package molding process caused by gathering of the internal leads on only one side, thereby enhancing reliability of the semiconductor package. There is also no need to separately form a heat sink structure for eliminating heat of the semiconductor chip since the dummy leads function as the heat sink.

REFERENCES:
patent: 5150194 (1992-09-01), Brooks et al.
patent: 5287000 (1994-02-01), Takahashi et al.
patent: 5309017 (1994-05-01), Maruyama

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